Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17048242
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Filing Dt:
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10/16/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Inventor:
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Seina Noda
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Title:
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PACKAGING METHOD FOR POLYCRYSTALLINE SILICON, DOUBLE-PACKAGING METHOD FOR POLYCRYSTALLINE SILICON, AND PRODUCING METHOD OF RAW MATERIAL FOR MONOCRYSTALLINE SILICON
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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Assignment:
2
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| 5, MITA-CHO, |
| YOKKAICHI-SHI, MIE, JAPAN |
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| LOCKE LORD LLP |
| 701 8TH ST NW, SUITE 500 |
| WASHINGTON, DC 20001-4360 |
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