Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/07/2021
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Application #:
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16950020
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Filing Dt:
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11/17/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Inventor:
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You-Hsien LIN
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Title:
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THROUGH-SILICON VIA (TSV) TEST CIRCUIT, TSV TEST METHOD AND INTEGRATED CIRCUITS (IC) CHIP
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Assignment:
1
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EMPLOYMENT AGREEMENT-CONTRACT
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| ROOM 630, HAIHENG BUILDING, NO. 6, CUIWEI ROAD |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| HEFEI, ANHUI, CHINA 230000 |
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| SHEPPARD MULLIN RICHTER & HAMPTON LLP |
| 379 LYTTON AVENUE |
| ATTN: JING ZHENG |
| PALO ALTO, CA 94301 |
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