Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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16572369
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Filing Dt:
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09/16/2019
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Publication #:
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Pub Dt:
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03/18/2021
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Inventors:
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Ching-Nen Peng, Hsien-Tang Wang, Mill-Jer Wang, Chi-Chang Lai
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Title:
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ELECTROMAGNETIC SHIELDING DURING WAFER STAGE TESTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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