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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/03/2021
Application #:
16573817
Filing Dt:
09/17/2019
Publication #:
Pub Dt:
03/18/2021
Inventors:
Shin-Yi Yang, Yu-Chen Chan, Ming-Han Lee, Hai-Ching Chen, Shau-Lin Shue
Title:
Graphene-Assisted Low-Resistance Interconnect Structures and Methods of Formation Thereof
Assignment: 1
Reel/Frame:
056040/0869Recorded: 04/26/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/19/2019
Exec Dt:
09/19/2019
Exec Dt:
09/19/2019
Exec Dt:
09/19/2019
Exec Dt:
09/18/2019
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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