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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/20/2022
Application #:
16569429
Filing Dt:
09/12/2019
Publication #:
Pub Dt:
03/18/2021
Inventors:
Martin Schrems, Markus Leitgeb, Steve Anderson
Title:
Electronic Module With Single or Multiple Components Partially Surrounded by a Thermal Decoupling Gap
Assignment: 1
Reel/Frame:
052687/0455Recorded: 05/18/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2019
Exec Dt:
11/13/2019
Exec Dt:
05/12/2020
Assignee:
FABRIKSGASSE 13
LEOBEN, AUSTRIA 8700
Correspondent:
SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM
50 GLENLAKE PARKWAY, SUITE 340
ATLANTA, GA 30328

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