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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/26/2023
Application #:
17052264
Filing Dt:
11/02/2020
Publication #:
Pub Dt:
03/25/2021
Inventors:
Gota TAKIMOTO, Michihiko IRIE
Title:
THERMALLY CONDUCTIVE RESIN COMPOSITION
Assignment: 1
Reel/Frame:
054240/0250Recorded: 11/02/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/28/2020
Exec Dt:
09/28/2020
Assignee:
2-8, DOJIMA HAMA 2-CHOME, KITA-KU, OSAKA-SHI
OSAKA, JAPAN 5308230
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
1025 CONNECTICUT AVENUE, N.W.
SUITE 500
WASHINGTON, DC 20036

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