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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/25/2023
Application #:
17024210
Filing Dt:
09/17/2020
Publication #:
Pub Dt:
03/25/2021
Inventors:
Makoto KOBAYASHI, Okito UMEHARA, Takashi MORI, Kazunari TAMURA
Title:
METHOD OF PROCESSING WAFER, AND CHIP MEASURING APPARATUS
Assignment: 1
Reel/Frame:
053806/0506Recorded: 09/17/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/24/2020
Exec Dt:
08/24/2020
Exec Dt:
08/24/2020
Exec Dt:
08/24/2020
Assignee:
13-11, OMORI-KITA 2-CHOME, OTA-KU,
TOKYO, JAPAN 143-8580
Correspondent:
GREER, BURNS & CRAIN, LTD
300 S. WACKER DR.
SUITE 2500
CHICAGO, IL 60606

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