Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/09/2021
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Application #:
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16576240
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Filing Dt:
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09/19/2019
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Publication #:
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Pub Dt:
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03/25/2021
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Inventors:
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Ravi K. Bonam, Mukta Ghate Farooq, Dinesh Gupta, James J. Kelly
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Title:
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PLANAR WAFER LEVEL FAN-OUT OF MULTI-CHIP MODULES HAVING DIFFERENT SIZE CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| FRANK V. DEROSA |
| 48 SOUTH SERVICE ROAD, SUITE 100 |
| RYAN, MASON & LEWIS, LLP |
| MELVILLE, NY 11747 |
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