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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/22/2022
Application #:
16909162
Filing Dt:
06/23/2020
Publication #:
Pub Dt:
04/01/2021
Inventors:
Hiroyuki ICHIKAWA, Takashi KUME, Munehiro WADA
Title:
VEHICLE-USE RESIN MODULE AND METHOD OF MANUFACTURING VEHICLE-USE RESIN MODULE
Assignment: 1
Reel/Frame:
053707/0976Recorded: 09/08/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/25/2020
Exec Dt:
06/25/2020
Exec Dt:
06/25/2020
Assignee:
1, HIGASHI 3-CHOME
KOMAKI-SHI, AICHI, JAPAN 485-8550
Correspondent:
AARON L. WEBB
OLIFF PLC
P.O. BOX 320850
ALEXANDRIA, VA 22320-4850

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