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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/29/2022
Application #:
16584666
Filing Dt:
09/26/2019
Publication #:
Pub Dt:
04/01/2021
Inventors:
Richard Vreeland, Colin Carver, William Brezinski, Michael Christenson, Nafees Kabir
Title:
METHODS & STRUCTURES FOR IMPROVED ELECTRICAL CONTACT BETWEEN BONDED INTEGRATED CIRCUIT INTERFACES
Assignment: 1
Reel/Frame:
050681/0616Recorded: 10/10/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/09/2019
Exec Dt:
10/09/2019
Exec Dt:
10/09/2019
Exec Dt:
10/09/2019
Exec Dt:
10/09/2019
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95054
Correspondent:
GREEN, HOWARD, & MUGHAL LLP
5 CENTERPOINTE DR.
LAKE OSWEGO, OR 97035

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