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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17107799
Filing Dt:
11/30/2020
Publication #:
Pub Dt:
04/01/2021
Inventors:
Chaohong WANG, KE YANG, Hanjian LENG
Title:
PACKAGING STRUCTURE, AND FORMING METHOD AND PACKAGING METHOD THEREOF
Assignment: 1
Reel/Frame:
058701/0722Recorded: 01/20/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/24/2020
Exec Dt:
11/24/2020
Exec Dt:
11/19/2020
Assignee:
FLOOR 13, PHASE B, TENGFEI INDUSTRIAL BUILDING, FUTIAN FREE TRADE ZONE
SHENZHEN, GUANGDONG, CHINA 518045
Correspondent:
JAMIE J. ZHENG
3790 EL CAMINO REAL #1147
PALO ALTO, CA 94306

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