Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17117760
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Filing Dt:
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12/10/2020
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Publication #:
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Pub Dt:
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04/08/2021
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Inventors:
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Yung-Chun LEE, Yi-Chun TSAI, Chun-Ying WU, Wei-Hsiang SU, Shao-Hsuan HUANG, Ke-Chaung LU
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Title:
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NANOIMPRINTING BY USING SOFT MOLD AND RESIST SPREADING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1, DAXUE RD., EAST DIST. |
| TAINAN CITY, TAIWAN 701 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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