Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16598825
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Filing Dt:
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10/10/2019
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Publication #:
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Pub Dt:
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04/15/2021
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Inventors:
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James T. Schwindt, Frank E. Seckar, Tyler J. Theobald, Stephen J. Klein et al
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Title:
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MULTILAYER PACKAGING FILM AND PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2301 INDUSTRIAL DRIVE |
| NEENAH, WISCONSIN 54956 |
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| BEMIS COMPANY, INC. |
| PO BOX 669 |
| OFFICE OF INTELLECTUAL PROPERTY COUNSEL |
| NEENAH, WI 54957 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2301 INDUSTRIAL DRIVE |
| NEENAH, WISCONSIN 54956 |
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| AMCOR FLEXIBLES NORTH AMERICA, INC. |
| PO BOX 669 |
| OFFICE OF INTELLECTUAL PROPERTY COUNSEL |
| NEENAH, WI 54957 |
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