Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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17033245
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Filing Dt:
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09/25/2020
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Publication #:
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Pub Dt:
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04/15/2021
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Inventors:
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John D. Brazzle, Frederick E. Beville, David R. Ng, Michael J. Anderson, Yucheng Ying
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Title:
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STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE TECHNOLOGY WAY |
| NORWOOD, MASSACHUSETTS 02062 |
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| KNOBBE MARTENS OLSON & BEAR LLP |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BAY F1 RAHEEN INDUSTRIAL ESTATE |
| LIMERICK, IRELAND |
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| KNOBBE MARTENS OLSON & BEAR LLP |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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05/10/2024 02:32 PM
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