Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16599650
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Filing Dt:
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10/11/2019
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Publication #:
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Pub Dt:
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04/15/2021
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Inventors:
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John P. Bettencourt, Paul M. Alcorn, Michael S. Davis, Paul J. Duval et al
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Title:
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OHMIC ALLOY CONTACT REGION SEALING LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 870 WINTER STREET |
| WALTHAM, MASSACHUSETTS 02451-1449 |
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| DALY, CROWLEY, MOFFORD & DURKEE, LLP |
| ONE UNIVERSITY AVENUE |
| SUITE 201B |
| WESTWOOD, MA 02090 |
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05/16/2024 03:47 PM
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