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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17000380
Filing Dt:
08/24/2020
Publication #:
Pub Dt:
04/22/2021
Inventors:
Hong Jin PARK, Sung Soo PARK
Title:
CRACK-FREE GLASS SUBSTRATE CUTTING AND THINNING METHOD
Assignment: 1
Reel/Frame:
053569/0921Recorded: 08/24/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/21/2020
Exec Dt:
08/18/2020
Assignees:
6F., 41-4, BURIM-RO 170BEON-GIL, DONGAN-GU
ANYANG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 14055
10, HAEBONG-RO 273 BEON-GIL, DANWON-GU
ANSAN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 15420
Correspondent:
REVOLUTION IP, PLLC
2000 DUKE ST.
SUITE 300
ALEXANDRIA, VA 22314

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