Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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16654187
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Filing Dt:
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10/16/2019
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Publication #:
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Pub Dt:
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04/22/2021
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Inventors:
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Po-Hao TSAI, Yi-Wen WU, Shin-Puu JENG, Meng-Liang LIN, Po-Yao CHUANG, Techi WONG
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Title:
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STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT FEATURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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MCCLURE, QUALEY & RODACK, LLP |
280 INTERSTATE NORTH CIRCLE SE |
SUITE 550 |
ATLANTA, GA 30339 |
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