Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17087771
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Filing Dt:
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11/03/2020
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Publication #:
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Pub Dt:
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05/06/2021
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Inventors:
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Eunwoong LEE, YongSung CHUN, BongSeock KIM
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Title:
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SOFT POLYOLEFIN RESIN COMPOSITION WITH IMPROVED DIRECT-CURRENT INSULATION CHARACTERISTICS AND ARTICLE MOLDED THEREFROM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 103, DOKGOT-2-RO, DAESAN-EUP |
| SEOSAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31900 |
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| HARNESS DICKEY (TROY) |
| 5445 CORPORATE DR. |
| SUITE 200 |
| TROY, MI 48098 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 103, DOKGOT 2-RO, DAESAN-EUP |
| SEOSAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF |
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| CPA GLOBAL |
| CASTLE STREET , LIBERATION HOUSE |
| ST HELIER, JERSEY, JE1 1BL JERSEY |
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06/01/2024 06:22 AM
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