Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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16488634
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Filing Dt:
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08/26/2019
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Publication #:
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Pub Dt:
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05/06/2021
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Inventors:
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Ryouhei Yumoto, Takeshi Kitahara, Tomoya Oohiraki, Yoshiyuki Nagatomo
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Title:
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METHOD FOR PRODUCING INSULATING CIRCUIT SUBSTRATE WITH HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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