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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/29/2022
Application #:
17147717
Filing Dt:
01/13/2021
Publication #:
Pub Dt:
05/06/2021
Inventors:
Juergen Hoegerl, Ordwin Haase, Tobias Kist
Title:
Double Sided Semiconductor Package
Assignment: 1
Reel/Frame:
054904/0164Recorded: 01/13/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/24/2019
Exec Dt:
10/09/2019
Exec Dt:
07/24/2019
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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