Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16669531
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Filing Dt:
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10/31/2019
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Publication #:
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Pub Dt:
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05/06/2021
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Inventors:
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RAMASAMY CHOCKALINGAM, JUAN BOON TAN, CHEE KONG LEONG, RANJAN RAJOO, XUESONG RAO et al
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Title:
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BOND PADS OF SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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| GLOBALFOUNDRIES, INC. |
| SANTA CLARA GATEWAY |
| 2600 GREAT AMERICA WAY |
| SANTA CLARA, CA 95054 |
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