Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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16628206
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Filing Dt:
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01/02/2020
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Publication #:
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Pub Dt:
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05/20/2021
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Inventors:
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Hye Won JEONG, Jinyoung PARK, Kyunghwan KIM, Chan Hyo PARK
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Title:
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POLYIMIDE FILM HAVING IMPROVED THERMAL CONDUCTIVITY AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| ROTHWELL, FIGG, ERNST & MANBECK, P.C. |
| 14TH STREET, N.W., SUITE 800 |
| WASHINGTON, DC 20005 |
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