Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/21/2022
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Application #:
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16685090
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Filing Dt:
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11/15/2019
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Publication #:
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Pub Dt:
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05/20/2021
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Inventors:
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Benjamin James Fletcher, James Edward Myers, Shidhartha Das, Terrence Sui Tung Mak
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Title:
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System-In-Package Architecture with Wireless Bus Interconnect
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 110 FULBOURN ROAD |
| CAMBRIDGE, UNITED KINGDOM CB1 9NJ |
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| LEVEQUE INTELLECTUAL PROPERTY LAW, P.C. |
| 241 E. 4TH STREET, #102 |
| FREDERICK, MD 21701 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ELECTRONICS AND COMPUTER SCIENCE |
| UNIVERSITY OF SOUTHAMPTON |
| SOUTHAMPTON, UNITED KINGDOM SO17 1BJ |
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| LEVEQUE INTELLECTUAL PROPERTY LAW, P.C. |
| 241 E. 4TH STREET, #102 |
| FREDERICK, MD 21701 |
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05/08/2024 01:19 PM
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