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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16952178
Filing Dt:
11/19/2020
Publication #:
Pub Dt:
05/27/2021
Inventors:
In Jin SAH, Jong Bae Hwang, Eung Seon Kim, Min Hwan Kim
Title:
NICKEL-BASED SUPERALLOY FOR DIFFUSION BONDING AND METHOD FOR DIFFUSION BONDING USING THE SAME
Assignment: 1
Reel/Frame:
054414/0434Recorded: 11/19/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/10/2020
Exec Dt:
11/10/2020
Exec Dt:
11/10/2020
Exec Dt:
11/10/2020
Assignee:
(DEOKJIN-DONG) 111, DAEDEOK-DAERO 989BEON-GIL, YUSEONG-GU
DAEJEON, KOREA, REPUBLIC OF 34057
Correspondent:
LEX IP MEISTER, PLLC
5180 PARKSTONE DRIVE, SUITE 175
CHANTILLY, VA 20151

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