Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17098662
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Filing Dt:
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11/16/2020
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Publication #:
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Pub Dt:
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05/27/2021
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Inventors:
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Ke Dai, Jian Wei, Jiajia Yan
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Title:
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PACKAGE STRUCTURE FOR POWER SUPPLY MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 301, ZONE B, BUILDING F |
| XUZHUANG SOFTWARE PARK, XUANWU DISTRICT |
| NANJING, CHINA 210042 |
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| MICHAEL C. STEPHENS |
| 22779 MONTROSE COURT |
| LOS GATOS, CA 95033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1#368, BRAINSTORMING SPACE, SOFTWARE PARK |
| NO. 10 TIANTONG ROAD, HIGH-TECH ZONE |
| HEFEI CITY, ANHUI PROVINCE, CHINA 230088 |
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| MICHAEL C. STEPHENS |
| 22779 MONTROSE COURT |
| LOS GATOS, CA 95033 |
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05/15/2024 04:18 AM
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