Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/13/2022
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Application #:
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16074335
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Filing Dt:
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07/31/2018
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Publication #:
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Pub Dt:
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06/03/2021
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Inventors:
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Fumihiro MUKAI, Kotaro YAMAURA, Hiroki NAITO, Yasuhiro SAKO
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Title:
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THERMALLY CONDUCTIVE MOLDED RESIN ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MINATOJIMA MINAMIMACHI 4-CHOME, CHUO-KU, KOBE-SHI |
| HYOGO, JAPAN 650-0047 |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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