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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11562942
Issue Dt:
01/24/2023
Application #:
16499589
Filing Dt:
09/30/2019
Publication #:
20210166991
Pub Dt:
06/03/2021
Inventors:
Robert Brunner, Neng Liu, Stephane Lessard
Title:
Chip-Carrier Socket for Microfluidic-Cooled Three-Dimensional Electronic/Photonic Integrated Circuits
Assignment: 1
Reel/Frame:
050566/0984Recorded: 09/30/2019Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LIU, NENG
Exec Dt:
04/18/2017
BRUNNER, ROBERT
Exec Dt:
04/19/2017
LESSARD, STAPHANE
Exec Dt:
04/18/2017
Assignee:
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
SE-164 83
STOCKHOLM, SWEDEN
Correspondent:
MURPHY, BILAK & HOMILLER/ERICSSON
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
050676/0830Recorded: 10/09/2019Pages: 9
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE INVENTOR FIRST NAME PREVIOUSLY RECORDED ON REEL 050566 FRAME 0984. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
LIU, NENG
Exec Dt:
04/18/2017
BRUNNER, ROBERT
Exec Dt:
04/19/2017
LESSARD, STEPHANE
Exec Dt:
04/18/2017
Assignee:
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
SE-164 83
STOCKHOLM, SWEDEN
Correspondent:
MURPHY, BILAK & HOMILLER/ERICSSON
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518

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