Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17183056
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Filing Dt:
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02/23/2021
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Publication #:
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Pub Dt:
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06/10/2021
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Inventors:
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Hui Suk YANG, Hyung Il JUNG, Hyeon Jun KIM
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Title:
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PERFORATED PLATE MICROSTRUCTURE MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 50, YONSEI-RO, SEODAEMUN-GU |
| SEOUL, KOREA, REPUBLIC OF 03722 |
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| #208, 272, DIGITAL-RO, GURO-GU |
| SEOUL, KOREA, REPUBLIC OF 08389 |
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| STUDEBAKER & BRACKETT PC |
| 8255 GREENSBORO DRIVE |
| SUITE 300 |
| TYSONS, VA 22102 |
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05/23/2024 06:34 AM
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