Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17035758
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Filing Dt:
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09/29/2020
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Publication #:
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Pub Dt:
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06/10/2021
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Inventors:
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Atsushi KAWAMURA, Kensuke KASHIMURA, Toshio KAJI, Yoshifumi ICHIKAWA et al
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Title:
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LAMINATION MOLDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-12-1, NAKAMACHIDAI, TSUZUKI-KU, YOKOHAMA, |
| KANAGAWA, JAPAN 224-8522 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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