Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/25/2022
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Application #:
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17268036
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Filing Dt:
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02/11/2021
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Publication #:
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Pub Dt:
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06/17/2021
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Inventors:
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Junitsu Yamakawa, Chunhui Dou, Risa Kimura, Toshio Yokoyama
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Title:
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COPPER OXIDE SOLID FOR USE IN PLATING OF A SUBSTRATE, METHOD OF PRODUCING THE COPPER OXIDE SOLID, AND APPARATUS FOR SUPPLYING A PLATING SOLUTION INTO A PLATING TANK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OTA-KU |
| TOKYO, JAPAN 1448510 |
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| BAKERHOSTETLER |
| 999 THIRD AVENUE |
| SUITE 3900 |
| SEATTLE, WA 98104-4040 |
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