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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/18/2022
Application #:
16721762
Filing Dt:
12/19/2019
Publication #:
Pub Dt:
06/24/2021
Inventors:
Shuen-Shin LIANG, Fang-Wei LEE, Mrunal Abhijith KHADERBAD, Sung-Li WANG, Yu-Yun PENG et al
Title:
Method for Making Self-Aligned Barrier for Metal Vias In-Situ during a Metal Halide Pre-Clean and Associated Interconnect Structure
Assignment: 1
Reel/Frame:
051746/0141Recorded: 02/06/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Exec Dt:
01/17/2020
Assignee:
NO.8, LI-HSIN RD.6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondent:
MASCHOFF BRENNAN
1389 CENTER DRIVE, SUITE 300
PARK CITY, UT 84098

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