Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2023
|
Application #:
|
17249325
|
Filing Dt:
|
02/26/2021
|
|
Publication #:
|
|
Pub Dt:
|
06/24/2021
| | | | |
|
Inventors:
|
Christian NEUGIRG, Peter SCHERL
|
|
Title:
|
SEMICONDUCTOR CHIP PACKAGE COMPRISING SUBSTRATE, SEMICONDUCTOR CHIP, AND LEADFRAME AND A METHOD FOR FABRICATING THE SAME
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
|
|
|
|
| HARRITY & HARRITY, LLP |
| 11350 RANDOM HILLS ROAD |
| SUITE 600 |
| FAIRFAX, VA 22030 |
|
|
Search Results as of:
05/13/2024 01:08 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
