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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/07/2023
Application #:
17003639
Filing Dt:
08/26/2020
Publication #:
Pub Dt:
06/24/2021
Inventors:
Sunkyoung SEO, Taehwan KIM, Hyunjung SONG, Hyoeun KIM, Wonil LEE, Sanguk HAN
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
053609/0248Recorded: 08/26/2020Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/13/2020
Exec Dt:
07/13/2020
Exec Dt:
07/14/2020
Exec Dt:
07/13/2020
Exec Dt:
07/13/2020
Exec Dt:
07/03/2020
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, N.W.
SUITE 900
WASHINGTON, DC 20006

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