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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/23/2024
Application #:
17267887
Filing Dt:
02/11/2021
Publication #:
Pub Dt:
06/24/2021
Inventors:
Ryosuke MITSUI, Junya SATO, Atsushi TANAKA, Kosuke MATSUO
Title:
METHOD FOR MANUFACTURING MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT, MOUNTING STRUCTURE FOR ELECTRONIC COMPONENT, ELECTRONIC MODULE, AND WIRING SHEET
Assignment: 1
Reel/Frame:
055229/0591Recorded: 02/11/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/18/2021
Exec Dt:
01/18/2021
Exec Dt:
01/18/2021
Exec Dt:
01/18/2021
Assignee:
21-1, DOGENZAKA 1-CHOME, SHIBUYA-KU
TOKYO, JAPAN 1500043
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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