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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/05/2022
Application #:
16937344
Filing Dt:
07/23/2020
Publication #:
Pub Dt:
06/24/2021
Inventors:
Shuen-Shin Liang, Chen-Han Wang, Keng-Chu Lin, Tetsuji Ueno, Ting-Ting Chen
Title:
SEAL MATERIAL FOR AIR GAPS IN SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
056534/0327Recorded: 06/14/2021Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2021
Exec Dt:
04/25/2021
Exec Dt:
04/25/2021
Exec Dt:
05/05/2021
Exec Dt:
04/28/2021
Assignee:
TAI
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C.
1100 NEW YORK AVENUE, NW
WASHINGTON, DC 20005

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