Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2023
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Application #:
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17188739
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Filing Dt:
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03/01/2021
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Publication #:
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Pub Dt:
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07/01/2021
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Inventors:
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Bo Peng, Ling Gao, Xiaojun Zhang, Yang Liu, Qiang Duan, Dapeng Bi, Congge Lu
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Title:
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PACKAGING STRUCTURE AND PACKAGING METHOD OF DIGITAL CIRCUIT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 113 COOPERATION ROAD, XINHUA DISTRICT, HEBEI |
SHIJIAZHUANG, CHINA 050051 |
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SLATER MATSIL LLP |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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05/01/2024 02:21 AM
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