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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/27/2023
Application #:
16949503
Filing Dt:
10/30/2020
Publication #:
Pub Dt:
07/01/2021
Inventors:
Mikael Tuominen, Seok Kim Tay
Title:
Component Carrier With Low Shrinkage Dielectric Material
Assignment: 1
Reel/Frame:
055849/0866Recorded: 01/23/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/14/2021
Exec Dt:
01/14/2021
Assignee:
NO. 5000 JIN DU ROAD
XINZHUANG INDUSTRY PARK, MINHANG DISTRICT
SHANGHAI, CHINA 201108
Correspondent:
SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM
50 GLENLAKE PARKWAY, SUITE 340
ATLANTA, GA 30328

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