Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/20/2022
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Application #:
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17180405
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Filing Dt:
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02/19/2021
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Publication #:
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Pub Dt:
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07/01/2021
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Inventors:
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Dian-Sheg Yu, Ren-Fen Tsui, Jhon Jhy Liaw, Ying-Jhe Fu
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Title:
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Interconnect Device and Method
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE TYPOGRAPHICAL ERROR IN THE 3RD INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 050349 FRAME: 0115. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL LLP/TSMC |
17950 PRESTON ROAD, SUITE 1000 |
DALLAS, TX 75252 |
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05/09/2024 07:32 PM
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