Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17059288
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Filing Dt:
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11/27/2020
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Publication #:
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Pub Dt:
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07/15/2021
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Inventors:
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Yeong Deuk SEO, Sang Hwa LEE, Sang Hyun HONG
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Title:
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Polyamide Resin Composition and Molded Product Comprising Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 300, OLYMPIC-RO SONGPA-GU |
| SEOUL, KOREA, REPUBLIC OF 05551 |
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| ADDITON, HIGGINS & PENDLETON, P.A. |
| 10706 SIKES PLACE |
| SUITE 350 |
| CHARLOTTE, NC 28277 |
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