Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17213748
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Filing Dt:
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03/26/2021
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Publication #:
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Pub Dt:
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07/15/2021
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Inventors:
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Osamu Nabeya, Makoto Fukushima, Satoru Yamaki
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Title:
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SUBSTRATE HOLDING APPARATUS, SUBSTRATE SUCTION DETERMINATION METHOD, SUBSTRATE POLISHING APPARATUS, SUBSTRATE POLISHING METHOD, METHOD OF REMOVING LIQUID FROM UPPER SUFACE OF WAFER TO BE POLISHED, ELASTIC FILM FOR PRESSING WAFER AGAINST POLISHING PAD, SUBSTRATE RELEASE METHOD, AND CONSTANT AMOUNT GAS SUPPLY APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OTA-KU |
| TOKYO, JAPAN 1448510 |
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| BAKERHOSTETLER |
| 999 THIRD AVENUE |
| SUITE 3900 |
| SEATTLE, WA 98104-4040 |
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