Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/21/2021
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Application #:
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16741011
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Filing Dt:
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01/13/2020
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Publication #:
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Pub Dt:
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07/15/2021
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Inventors:
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Zhihong Zhang, James Gordon Boyd, Ronghua Zhu
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Title:
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Deep Trench Isolation And Substrate Connection on SOI
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6501 WILLIAM CANNON DRIVE |
| AUSTIN, TEXAS 78735 |
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| NXP USA, INC. LAW DEPARTMENT |
| 6501 WILLIAM CANNON DRIVE WEST TX30/OE62 |
| AUSTIN, TX 78735 |
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