Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/09/2022
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Application #:
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17221657
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Filing Dt:
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04/02/2021
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Publication #:
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Pub Dt:
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07/22/2021
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Inventor:
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Yangyang DAI
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Title:
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INTEGRATED CIRCUIT (IC) POWER-UP TESTING METHOD AND DEVICE, AND ELECTRONIC EQUIPMENT
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Assignment:
1
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EMPLOYMENT AGREEMENT-CONTRACT
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA 230601 |
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| SHEPPARD MULLIN RICHTER & HAMPTON LLP |
| 379 LYTTON AVE. |
| ATTN: JING ZHENG |
| PALO ALTO, CA 94301 |
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