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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11257753
Issue Dt:
02/22/2022
Application #:
16884925
Filing Dt:
05/27/2020
Publication #:
20210225762
Pub Dt:
07/22/2021
Inventors:
YU-YUN PENG, CHEN-HAN WANG, KENG-CHU LIN, KHADERBAD MRUNAL ABHIJITH, FU-TING YEN et al
Title:
INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE INTERCONNECT STRUCTURE
Assignment: 1
Reel/Frame:
052765/0354Recorded: 05/27/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MRUNAL ABHIJITH, KHADERBAD
Exec Dt:
05/12/2020
PENG, YU-YUN
Exec Dt:
05/14/2020
YEN, FU-TING
Exec Dt:
05/15/2020
WANG, CHEN-HAN
Exec Dt:
05/18/2020
PERNG, TSU-HSIU
Exec Dt:
05/12/2020
LIN, KENG-CHU
Exec Dt:
05/12/2020
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
1100 QUAIL STREET, SUITE 202
NEWPORT BEACH, CA 92660

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