Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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17221687
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Filing Dt:
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04/02/2021
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Publication #:
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Pub Dt:
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07/22/2021
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Inventors:
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Risheng LI, Yunfeng LIU, Liedong WANG
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Title:
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HEAT DISSIPATION PLATE FOR CHIP HEAT DISSIPATION, SERVER HEAT DISSIPATION SYSTEM, AND HEATING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8/F, CP CENTRE, CBD CORE AREA Z14, GUANGHUA ROAD, CHAOYANG DISTRICT |
BEIJING, CHINA |
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YANGZHOU DU |
PO BOX 423 |
MCLEAN, VA 22101 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ROOM 449, BLOCK A, NO. 326, NANYUAN STREET, YUHANG DISTRICT |
HANGZHOU, CHINA |
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YANGZHOU DU |
PO BOX 423 |
MCLEAN, VA 22101 |
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05/12/2024 08:42 PM
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