Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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16950615
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Filing Dt:
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11/17/2020
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Publication #:
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Pub Dt:
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07/29/2021
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Inventor:
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Shigeru Sato
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Title:
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PLATED METAL BONDING METHOD AND PLATED METAL BONDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-9-28 HIGASHIHIE, HAKATA-KU, FUKUOKA-SHI |
| FUKUOKA, JAPAN 812-0007 |
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| SHINTARO YAMADA |
| 30 BROAD ST. |
| 21ST FLOOR |
| NEW YORK, NY 10004 |
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05/21/2024 01:48 PM
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