Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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17017462
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Filing Dt:
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09/10/2020
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Publication #:
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Pub Dt:
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07/29/2021
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Inventors:
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Nathaniel P. Wyckoff, Jacob R. Mauermann, Richard Korneisel, Brandon C. Hamilton et al
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Title:
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Controlled Induced Warping of Electronic Substrates via Electroplating
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 400 COLLINS ROAD, NE |
| CEDAR RAPIDS, IOWA 52498 |
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| ROCKWELL COLLINS, INC./SUITER SWANTZ SUI |
| 14301 FNB PARKWAY |
| SUITE 220 |
| OMAHA, NE 68154 |
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