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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
12/20/2022
Application #:
16774357
Filing Dt:
01/28/2020
Publication #:
Pub Dt:
07/29/2021
Inventors:
Eung San Cho, Petteri Palm
Title:
Semiconductor Package Having a Solderable Contact Pad Formed by a Load Terminal Bond Pad of a Power Semiconductor Die
Assignment: 1
Reel/Frame:
051801/0957Recorded: 02/12/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/28/2020
Assignee:
101 N. SEPULVEDA BLVD.
EL SEGUNDO, CALIFORNIA 90245
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 2
Reel/Frame:
051801/0865Recorded: 02/12/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/29/2020
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON TECHNO
1255 CRESCENT GREEN
SUITE 200
CARY, NC 27518
Assignment: 3
Reel/Frame:
053033/0066Recorded: 06/25/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/24/2020
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
IRIS DRUCKENBROD
AM CAMPEON 1-15
PATENT DEPARTMENT MUC/11.2.348
NEUBIBERG, 85579 GERMANY

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