Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17234554
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Filing Dt:
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04/19/2021
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Publication #:
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Pub Dt:
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08/05/2021
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Inventor:
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Chihwei CHANG
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Title:
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THROUGH-SILICON VIA INTERCONNECTION STRUCTURE AND METHODS FOR FABRICATING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA 230601 |
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| SHEPPARD MULLIN RICHTER & HAMPTON LLP |
| 379 LYTTON AVE. |
| ATTN: JING ZHENG |
| PALO ALTO, CA 94301 |
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