Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/22/2022
|
Application #:
|
16782953
|
Filing Dt:
|
02/05/2020
|
|
Publication #:
|
|
Pub Dt:
|
08/05/2021
| | | | |
|
Inventors:
|
Teng-Hao YEH, Chih-Wei HU, Yu-Wei JIANG
|
|
Title:
|
DUMMY VERTICAL STRUCTURES FOR ETCHING IN 3D NAND MEMORY AND OTHER CIRCUITS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO. 16 LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
|
|
|
|
| MACRONIX C/O HAYNES BEFFEL & WOLFELD LLP |
| P. O. BOX 366 |
| MARK A. HAYNES |
| HALF MOON BAY, CA 94019 |
|
|
Search Results as of:
05/23/2024 12:43 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
