Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16891265
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Filing Dt:
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06/03/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Inventors:
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Hak Gu KIM, Ho Kyung KANG, Seong Jong CHEON, Young Sik HUR, Jin Seon PARK, Yong Duk LEE
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Title:
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CHIP RADIO FREQUENCY PACKAGE AND RADIO FREQUENCY MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF |
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| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE FOURTH INVENTOR'S NAME ON THE COVER SHEET PREVIOUSLY RECORDED AT REEL: 052821 FRAME: 0537. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, GYEONGGI-DO |
| SUWON-SI, KOREA, REPUBLIC OF |
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| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
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